Koch-Chemie Micro Cut Soft Foam Pad — Soft Finishing Foam Pad

Koch-Chemie Micro Cut Soft Foam Pad is a soft foam polishing pad designed for delicate finishing and achieving maximum gloss.

Suitable for:

• removing holograms
• eliminating micro-scratches
• ultra-fine finishing
• use with Micro Cut polishes

The soft structure ensures gentle treatment of the surface while delivering a deep, mirror-like gloss.

Usage

1. Attach the pad to a polishing machine.
2. Apply a small amount of finishing polish.
3. Work at low speed.
4. Polish until maximum gloss is achieved.
5. Clean the pad after use.

Advantages

• Very gentle on surfaces
• Ideal for ultra-fine finishing
• Removes holograms and micro-defects
• Provides deep gloss
• Suitable for professional use