Koch-Chemie Micro Cut Hard Foam Pad — Firm Finishing Foam Pad

Koch-Chemie Micro Cut Hard Foam Pad is a firm foam polishing pad designed for removing holograms and micro-scratches during the finishing stage.

Suitable for:

• removing holograms
• eliminating light defects
• finishing polishing
• use with Micro Cut polishes

The firm structure ensures effective defect removal while maintaining a high gloss finish.

Usage

1. Attach the pad to a polishing machine.
2. Apply a small amount of finishing polish.
3. Work at low to medium speed.
4. Polish until desired result is achieved.
5. Clean the pad after use.

Advantages

• Removes holograms effectively
• High gloss finish
• Ideal for finishing stage
• Suitable for professional use
• Durable material