Koch-Chemie Polish & Sealing Foam Pad — very soft finishing pad, Ø126 × 25 mm

About the product

Koch-Chemie Polish & Sealing Foam Pad is a very soft finishing sponge for economical, even application of sealants such as 1K Nano and Lack-Polish grün. The Ø126 × 25 mm pad has an open-cell structure and milled edge.

Confirmed specification

• Article 9998337; Ø126 × 25 mm.
• Very soft open-cell foam with a milled edge.
• For economical and even application of compatible sealants and finishing products.

Application

1. Apply a small amount of sealant to the clean pad.
2. Spread the product evenly over the prepared surface with light pressure.
3. Follow the sealant’s curing and finishing instructions and clean the pad after use.

Important

Test the product and pad on a small area first. Do not use a contaminated pad on sensitive finishes.